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Rigid Capabilities List

 

Standard

Advanced (Limited Qty)

Material Types

1-2 Layers

FR-4, FR-4(180 Tg)

Teflon, Bt-Epoxy, Polyimide, Duriod Etc.

Multilayer

FR-4, FR-4(180 Tg)

Teflon, Polyimide, Rogers, Arlon, Hybrids

Material Thickness

2 Layers

.010 - .125

.008 - .200"

4 Layers

.031 - .125

.018 - .250"

6 Layers

.047 - .125

.031 - .250"

8 Layers

.062 - .125

.047 - .250"

Layer Count

1-10

12 +

Max Board Size

2 Layers

16.00 X 22.00"

16.50" X 23.00"

Mulitlayer

16.00 X 22.00"

16.00" X 22.50"

Copper Weight

Outer Layer

1 - 2 oz

3 - 8 oz

Inner Layer

1 - 2 oz

3 - 6 oz

Trace / Space (min)

Outer Layer

.005" / .005"

.003" / .004

Inner Layer

.005" / .005"

.003" / .004"

PCB Edge to Conductor Min

.015"

.010"

Minimum Dielectric Thickness

.005"

.003"

Smallest Drilled Via

.0138"

.010"

    Outer Via Pad Min.

.026"

.020"

    Inner Via Pad Min.

.026"

.020"

    Inner Layer Clearance Min.

.038"

.030"

PTH Tolerance Finished

+/- .003"

+/-.002"

Max Aspect Ratio

8:1

10:1

Plated Slots Min

.030"

.020"

Plated Features

Bumps, Edges, Countersinks / Bores, Pockets, Castellations

Plated Countersinks (Deg.)

80, 90, 100

80, 90, 100

Surface Finishes

HASL, ENIG

HASL, ENIG, Pb Free HASL, Tin, Silver

Soldermask Color

Green, Blue, Black, Red

Soldermask Dam (min)

.005"

.003"

Soldermask Clearance (min)

.004"

.002"

Legend Colors

White, Yellow, Black, Red, Blue

Controlled Impedance + / -

10 %

10 %

SMT Pitch for Electrical Test

.012"

.008"

Bow & Twist

.75 %

.75 %

Min Rout Width

.062"

.031"

IPC Class

Class II

Class III