IMPROVED WHITE TIN PROCESS
Nationwide Circuits has recently added Omikron to its production capabilities. Omikron is an exciting new HASL alternative using a improved immersion white tin process that produces super flat pads for SMT and BGA assembly.
Omikron Offers:
 |
Ease of Operation |
|
Capable of passing multiple assembly cycles |
|
Uniform flat and dense solderable surface |
|
Meets and exceeds Siemens shelf life test |
|
No poisoning of assemblers solder pot. |
|
Perfect for fine pitch assembly applications |
COMPARISONS |
Omikron | HASL | Organic |
| Fine Pitch Application | Yes | Problem | Yes |
| Flatness of Pad | Yes | No | Yes |
| Multiple Solderability | Yes | No | Problem |
| Electrical Test | Yes | Yes | Problem |
| Health & Environmental Concerns | Low | High | Low |
| Dimensional Stress | None | High | None |
| Compatible with all flux | Yes | Yes | No |
For more information on the Omikron process or for a free sample with your next order, call us today
Nationwide Circuits, Inc.
Phone 1-800-724-4800
Fax (585) 328-9152
E-Mail sales@nciproto.com
Copyright Nationwide Circuits Inc.
Last revised: February 21, 2008