Typical Physical Properties*

Typical Electrical Properties*

Descriptions*

FR-4
Allied Signal / Isola FR-404, FR-406 - Link to Allied Signal / Isola Laminate Systems
  FR-4 materials are still the predominant materials used for printed circuits. We are currently using FR-404 and FR-406 from Allied Signal for our multilayer builds. We carry a wide array of single and double sided materials in thickness' and copper weights to fit your specific requirements.

FR-406 - is a tetrafunctional epoxy system that has a Tg of 170 C and a Dk of 4.3. We see FR-406 being used in applications where a higher temperature material is needed.   We also recommend this material when layer counts begin to exceed 8 layers because it's higher thermal properties minimize Z-axis expansion and the potential for barrel cracking and pad lifting in complex designs.

GETEK - Link to GE Electromaterials tech page
GETEKŪ family of FR4 grade laminates offer improved electrical and thermal properties ideally suited for sophisticated circuitry and high end applications. A lower and more stable dielectric constant and dissipation factor, higher maximum operating temperatures, higher Tg and lower Z-expansion make this an ideal product for telecommunication, computer and microwave applications.

BT / Epoxy
Allied Signal / Isola G200 - Link to Allied Signal / Isola Laminate Systems
  The blending of bismaleimide / triazine and epoxy resin provides enhanced thermal, mechanical and electrical performance over standard epoxy systems. BT / Epoxy possesses characteristics that make it an excellent selection for larger panel sizes. Advantages such as a high Tg (180C) , Low coefficient of thermal expansion and excellent electrical insulation in high humidity and at higher temperatures make this an good material choice.

Polyimide
Allied Signal / Isola P95 - Link to Allied Signal / Isola Laminate Systems
  This base material system is engineered with an all polyimide resin that is suitable for any electronics that would normally require the ultimate performance of Kerimide 601 ( The past standard polyimide of the industry ). Thermal stability makes this material particularly attractive to applications with stringent high temperature requirements. Low coefficient of thermal expansion of the board provides plated through hole reliability in very high layer counts and thick MLB's.

Considerations:   Polyimide material is extremely expensive compared to FR4.   It's processing is also more difficult, leading to higher board prices. Polyimides are also not 94V-0 so you must consider your application.  Alternatives may be BT-epoxy or possibly a high temperature epoxy like FR-406.

PTFE
Taconic TLT - Link to Taconic tech page
  PTFE / woven glass materials have exceptionally well controlled electrical and mechanical properties. The dielectric constant range is 2.45 to 2.65 and can be specified anywhere within this range with a tolerance of +/- .05. The dissipation factor is approximately .0006 when measured @ 1MHz. Typical applications for TLT laminates include radar systems, phased array antennas, mobile communication systems, microwave test equipment, microwave transmission devices and RF components. Due to the wide range of Dk values and the custom nature of this material, special orders may be necessary.

Kapton
Dupont Pyralux LF
  Pyralux copper-clad laminated composites are constructed of DuPont Kapton polyimide film with copper foil on one or both sides, bonded together with a modified acrylic adhesive. Pyralux laminated composites are typically used to produce high reliability, high density circuitry of flexible, rigid-flex, and all-flexible multilayer constructions.

* Information on this page is for comparison only. Nationwide Circuits makes no warranties on the accuracy of this data and assumes no liability arising out of its use by others. Please refer to the manufactures of these materials for more in-depth information.

Copper Foil Thickness

** Based on IPC-CF-150